9 Einträge gefunden

1. Design of passive microwave components on multilayered printed circuit boards using functional vias

   1. Hardock, Andreas

   2016 - TUHH Open Research
2. Using coupled vias for band-pass filters in multilayered printed-circuit boards

   1. Hardock, Andreas
   2. Schuster, Christian

   2015 - TUHH Open Research
3. Modeling of mutual coupling between coaxial probes in flat metallic casings using the contour integral method

   1. Wu, Qi
   2. Vogt, Alexander
   3. Preibisch, Jan
   4. Hardock, Andreas
   5. Brüns, Heinz-Dietrich
   6. Schuster, Christian

   2015 - TUHH Open Research
4. Physics-based via and waveguide models for efficient SIW simulations in multilayer substrates

   1. Preibisch, Jan
   2. Hardock, Andreas
   3. Schuster, Christian

   2015 - TUHH Open Research
5. Efficient calculation of external fringing capacitances for physics-based PCB modeling

   1. Hardock, Andreas
   2. Dahl, David
   3. Brüns, Heinz-Dietrich
   4. Schuster, Christian

   2015 - TUHH Open Research
6. A nanoscale gigahertz source realized with Josephson scanning tunneling microscopy

   1. Jäck, Berthold
   2. Eltschka, Matthias
   3. Assig, Maximilian
   4. Hardock, Andreas
   5. Etzkorn, Markus
   6. Ast, Christian R.
   7. Kern, Klaus

   2015 - TUHH Open Research
7. Chebyshev filter design using vias as quasi-transmission lines in printed circuit boards

   1. Hardock, Andreas
   2. Brüns, Heinz-Dietrich
   3. Schuster, Christian

   2015 - TUHH Open Research
8. Application of vias as functional elements in microwave coupling structures

   1. Hardock, Andreas
   2. Rimolo-Donadio, Renato
   3. Brüns, Heinz-Dietrich
   4. Schuster, Christian

   2013 - TUHH Open Research
9. Analytical extraction of via near-field coupling using a multiple scattering approach

   1. Müller, Sebastian
   2. Hardock, Andreas
   3. Rimolo-Donadio, Renato
   4. Brüns, Heinz-Dietrich
   5. Schuster, Christian

   2013 - TUHH Open Research