25 Einträge gefunden

1. Hardware Verification of Via Crosstalk Cancellation for Differential BGA-to-BGA Links

   1. Scharff, Katharina
   2. Duan, Xiaomin
   3. Cocchini, Matteo
   4. Nguyen, Huu Hung
   5. Selezinski, Nicole
   6. Kaller, Dierk
   7. Harrer, Hubert

   2022 - TUHH Open Research
2. Hardware Verification of Via Crosstalk Cancellation for Differential BGA-to-BGA Links

   1. Scharff, Katharina
   2. Duan, Xiaomin
   3. Cocchini, Matteo
   4. Nguyen, Huu Hung
   5. Selezinski, Nicole
   6. Kaller, Dierk
   7. Harrer, Hubert

   2022 - TUHH Open Research
3. ANN Hyperparameter Optimization by Genetic Algorithms for Via Interconnect Classification

   1. Sanchez-Masis, Allan
   2. Carmona-Cruz, Allan
   3. Schierholz, Christian Morten
   4. Duan, Xiaomin
   5. Roy, Kallol
   6. Yang, Cheng
   7. Rimolo-Donadio, Renato

   2021 - TUHH Open Research
4. SI/PI-database of PCB-based interconnects for machine learning applications

   1. Schierholz, Christian
   2. Sanchez-Masis, Allan
   3. Carmona-Cruz, Allan
   4. Duan, Xiaomin
   5. Roy, Kallol
   6. Yang, Cheng
   7. Rimolo-Donadio, Renato

   2021 - TUHH Open Research - frei zugänglich
5. Exploration of differential via stub effect mitigation by using PAM4 and PAM8 line coding

   1. Scharff, Katharina
   2. Reuschel, Torsten
   3. Duan, Xiaomin
   4. Brüns, Heinz-Dietrich
   5. Schuster, Christian

   2017 - TUHH Open Research
6. Efficient prediction of equalization effort and channel performance for PCB-based data links

   1. Reuschel, Torsten
   2. Preibisch, Jan
   3. Scharff, Katharina
   4. Rimolo-Donadio, Renato
   5. Duan, Xiaomin
   6. Kwark, Young Hoon
   7. Schuster, Christian

   2017 - TUHH Open Research
7. High Frequency Characterization of Silicon Substrate and through Silicon Vias

   1. Duan, Xiaomin
   2. Böttcher, Mathias
   3. Dahl, David
   4. Schuster, Christian
   5. Tschoban, Christian
   6. Ndip, Ivan N.
   7. Lang, Klaus-Dieter

   2016 - TUHH Open Research
8. Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz

   1. Duan, Xiaomin
   2. Böttcher, Mathias
   3. Dobritz, Stephan
   4. Dahl, David
   5. Schuster, Christian
   6. Ndip, Ivan N.
   7. Lang, Klaus-Dieter

   2016 - TUHH Open Research
9. On the upper bound of total uncorrelated crosstalk in large through silicon via arrays

   1. Dahl, David
   2. Reuschel, Torsten
   3. Duan, Xiaomin
   4. Ndip, Ivan N.
   5. Lang, Klaus-Dieter
   6. Schuster, Christian

   2016 - TUHH Open Research
10. Efficient total crosstalk analysis of large via arrays in silicon interposers

    1. Dahl, David
    2. Reuschel, Torsten
    3. Preibisch, Jan
    4. Duan, Xiaomin
    5. Ndip, Ivan N.
    6. Lang, Klaus-Dieter
    7. Schuster, Christian

    2016 - TUHH Open Research
11. Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method

    1. Duan, Xiaomin
    2. Dahl, David
    3. Schuster, Christian
    4. Ndip, Ivan N.
    5. Lang, Klaus-Dieter

    2015 - TUHH Open Research
12. Efficient computation of localized fields for through silicon via modeling up to 500 GHz

    1. Dahl, David
    2. Duan, Xiaomin
    3. Ndip, Ivan N.
    4. Lang, Klaus-Dieter
    5. Schuster, Christian

    2015 - TUHH Open Research
13. A rigorous approach for the modeling of through-silicon-via pairs using multipole expansions

    1. Duan, Xiaomin
    2. Dahl, David
    3. Ndip, Ivan N.
    4. Lang, Klaus-Dieter
    5. Schuster, Christian

    2015 - TUHH Open Research
14. Complete modeling of large via constellations in multilayer printed circuit boards

    1. Müller, Sebastian
    2. Happ, Fabian
    3. Duan, Xiaomin
    4. Rimolo-Donadio, Renato
    5. Brüns, Heinz-Dietrich
    6. Schuster, Christian

    2013 - TUHH Open Research
15. Characterization of TSV-induced loss and substrate noise coupling in advanced three-dimensional CMOS SOI technology

    1. Gu, Xiaoxiong
    2. Silberman, Joel A.
    3. Young, Albert M.
    4. Jenkins, Keith A.
    5. Dang, Bing
    6. Liu, Yong
    7. Duan, Xiaomin

    2013 - TUHH Open Research
16. Extensions to the contour integral method for efficient modeling of TM scattering in two-dimensional photonic crystals

    1. Preibisch, Jan
    2. Duan, Xiaomin
    3. Schuster, Christian

    2013 - TUHH Open Research
17. Signal and power integrity (SPI) co-analysis for high-speed communication channels

    1. Rimolo-Donadio, Renato
    2. Duan, Xiaomin
    3. Kwark, Young Hoon
    4. Gu, Xiaoxiong
    5. Baks, Christian W.
    6. Müller, Sebastian
    7. Winkel, Thomas Michael

    2013 - TUHH Open Research
18. Applying a physics-based via model for the simulation of Through Silicon Vias

    1. Dahl, David
    2. Duan, Xiaomin
    3. Beyreuther, Anne
    4. Ndip, Ivan N.
    5. Lang, Klaus-Dieter
    6. Schuster, Christian

    2013 - TUHH Open Research
19. Efficient DC analysis of power planes using contour integral method with circular elements

    1. Duan, Xiaomin
    2. Brüns, Heinz-Dietrich
    3. Schuster, Christian

    2013 - TUHH Open Research
20. Application of the transverse resonance method for efficient extraction of the dispersion relation of arbitrary layers in silicon interposers

    1. Dahl, David
    2. Duan, Xiaomin
    3. Beyreuther, Anne
    4. Ndip, Ivan N.
    5. Lang, Klaus-Dieter
    6. Schuster, Christian

    2013 - TUHH Open Research