Edge effects for square p+n pad diodes with guard rings, fabricated on high-ohmic silicon, are investigated. Using capacitance-voltage measurements of two pad diodes with different areas, the planar and the edge contributions to the diode capacitance are determined separately. It is found that the edge contributions are significant and that they strongly influence the determination of the doping concentration using capacitance-voltage measurements. After edge correction, the bulk doping of the pad diodes is found to be uniform within ±1.5 %, which agrees with expectations. The edge-correction method is verified using TCAD simulations of two circular pad diodes with different radii.