Environmental evaluation of LTCC flip-chip and surface mount technology for satellite applications

Link:
Autor/in:
Verlag/Körperschaft:
Hamburg University of Technology
Erscheinungsjahr:
2008
Medientyp:
Text
Schlagworte:
  • Flip-chip
  • Hybrid
  • LTCC
Beschreibung:
  • An environmental qualification of a hybrid technology for satellite applications is presented. It is based on low temperature co-fired ceramic modules attached in a surface mount technology to a mother board on an aluminum base plate. For the module assembly flip-chip mounting using ultrasonic and thermocompression bonding is considered. As a validation the circuits are exposed to numerous mechanical and thermal testing procedures. In three qualification steps the different manufacturing methods are evaluated and discussed.
Beziehungen:
DOI 10.1515/FREQ.2008.62.9-10.222
Quellsystem:
TUHH Open Research

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oai:tore.tuhh.de:11420/10750