4 Einträge gefunden

1. Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer Substrates

   1. Yildiz, Ömer Faruk
   2. Thomsen, Ole
   3. Bochard, Marc
   4. Yang, Cheng
   5. Schuster, Christian

   2021 - TUHH Open Research
2. Vertically Integrated Microwave-Filters Using Functional Via Structures in LTCC

   1. Yildiz, Ömer Faruk
   2. Thomsen, Ole
   3. Bochard, Marc
   4. Yang, Cheng
   5. Schuster, Christian

   2021 - TUHH Open Research
3. Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics

   1. Yildiz, Ömer Faruk
   2. Pathe, Nico
   3. Bochard, Marc
   4. Yang, Cheng
   5. Schuster, Christian

   2021 - TUHH Open Research
4. Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently

   1. Yildiz, Ömer Faruk
   2. Pathe, Nico
   3. Bochard, Marc
   4. Yang, Cheng
   5. Schuster, Christian

   2021 - TUHH Open Research