Autor/in Schuster, Christian Brüns, Heinz-Dietrich 8 Hardock, Andreas 5 Dahl, David 4 Vogt, Alexander 4 Duan, Xiaomin 3 Lang, Klaus-Dieter 3 Ndip, Ivan N. 3 Preibisch, Jan 3 Wu, Qi 3 Gronwald, Frank 2 Kwark, Young Hoon 2 Müller, Sebastian 2 Reuschel, Torsten 2 De, Soumya 1 Fan, Jun 1 Fielitz, Helge 1 Gu, Xiaoxiong 1 Liu, Dazhao 1 Liu, Peiguo 1 Ren, Liehui 1 Rimolo-Donadio, Renato 1 Triverio, Piero 1 Yang, Cheng 1 Zhang, Yao Jiang 1 alle zeigenListe einklappen
A measurement setup for quantification of electromagnetic interference in metallic casings Vogt, Alexander Brüns, Heinz-Dietrich Wu, Qi Gronwald, Frank Schuster, Christian 2015 - TUHH Open Research
Segmented physics-based modeling of multilayer printed circuit boards using stripline ports Reuschel, Torsten Müller, Sebastian Schuster, Christian 2015 - TUHH Open Research
Energy-aware signal integrity analysis for high-speed PCB links Müller, Sebastian Reuschel, Torsten Rimolo-Donadio, Renato Kwark, Young Hoon Brüns, Heinz-Dietrich Schuster, Christian 2015 - TUHH Open Research
Numerical and experimental evaluation of electromagnetic coupling between radiating antenna structures inside a computer casing Wu, Qi Vogt, Alexander Brüns, Heinz-Dietrich Gronwald, Frank Schuster, Christian 2015 - TUHH Open Research
Physics-based via and waveguide models for efficient SIW simulations in multilayer substrates Preibisch, Jan Hardock, Andreas Schuster, Christian 2015 - TUHH Open Research
A rigorous approach for the modeling of through-silicon-via pairs using multipole expansions Duan, Xiaomin Dahl, David Ndip, Ivan N. Lang, Klaus-Dieter Schuster, Christian 2015 - TUHH Open Research
Chebyshev filter design using vias as quasi-transmission lines in printed circuit boards Hardock, Andreas Brüns, Heinz-Dietrich Schuster, Christian 2015 - TUHH Open Research
Modeling of mutual coupling between coaxial probes in flat metallic casings using the contour integral method Wu, Qi Vogt, Alexander Preibisch, Jan Hardock, Andreas Brüns, Heinz-Dietrich Schuster, Christian 2015 - TUHH Open Research
An efficient hybrid finite-element analysis of multiple vias sharing the same anti-pad in an arbitrarily shaped parallel-plate pair Zhang, Yao Jiang Ren, Liehui Liu, Dazhao De, Soumya Gu, Xiaoxiong Kwark, Young Hoon Schuster, Christian 2015 - TUHH Open Research
Efficient calculation of external fringing capacitances for physics-based PCB modeling Hardock, Andreas Dahl, David Brüns, Heinz-Dietrich Schuster, Christian 2015 - TUHH Open Research
Validation of a flexible causality treatment for transient analysis of nonlinearly loaded structures Yang, Cheng Brüns, Heinz-Dietrich Liu, Peiguo Schuster, Christian 2015 - TUHH Open Research
Modeling absorbing materials in cavities with apertures using the thin sheet approximation Vogt, Alexander Brüns, Heinz-Dietrich Fielitz, Helge Schuster, Christian 2015 - TUHH Open Research
Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method Duan, Xiaomin Dahl, David Schuster, Christian Ndip, Ivan N. Lang, Klaus-Dieter 2015 - TUHH Open Research
Using coupled vias for band-pass filters in multilayered printed-circuit boards Hardock, Andreas Schuster, Christian 2015 - TUHH Open Research
Sensitivity analysis of via impedance using polynomial chaos expansion Preibisch, Jan Triverio, Piero Schuster, Christian 2015 - TUHH Open Research
Efficient computation of localized fields for through silicon via modeling up to 500 GHz Dahl, David Duan, Xiaomin Ndip, Ivan N. Lang, Klaus-Dieter Schuster, Christian 2015 - TUHH Open Research