8 Einträge gefunden

1. Energy-aware signal integrity analysis for high-speed PCB links

   1. Müller, Sebastian
   2. Reuschel, Torsten
   3. Rimolo-Donadio, Renato
   4. Kwark, Young Hoon
   5. Brüns, Heinz-Dietrich
   6. Schuster, Christian

   2015 - TUHH Open Research
2. Segmented physics-based modeling of multilayer printed circuit boards using stripline ports

   1. Reuschel, Torsten
   2. Müller, Sebastian
   3. Schuster, Christian

   2015 - TUHH Open Research
3. Analytical extraction of via near-field coupling using a multiple scattering approach

   1. Müller, Sebastian
   2. Hardock, Andreas
   3. Rimolo-Donadio, Renato
   4. Brüns, Heinz-Dietrich
   5. Schuster, Christian

   2013 - TUHH Open Research
4. Complete modeling of large via constellations in multilayer printed circuit boards

   1. Müller, Sebastian
   2. Happ, Fabian
   3. Duan, Xiaomin
   4. Rimolo-Donadio, Renato
   5. Brüns, Heinz-Dietrich
   6. Schuster, Christian

   2013 - TUHH Open Research
5. Signal and power integrity (SPI) co-analysis for high-speed communication channels

   1. Rimolo-Donadio, Renato
   2. Duan, Xiaomin
   3. Kwark, Young Hoon
   4. Gu, Xiaoxiong
   5. Baks, Christian W.
   6. Müller, Sebastian
   7. Winkel, Thomas Michael

   2013 - TUHH Open Research
6. Energy-aware analysis of electrically long high speed I/O links

   1. Müller, Sebastian
   2. Duan, Xiaomin
   3. Schuster, Christian

   2012 - TUHH Open Research
7. Impact of multiple scattering on passivity of equivalent-circuit via models

   1. Duan, Xiaomin
   2. Rimolo-Donadio, Renato
   3. Müller, Sebastian
   4. Han, Ki Jin
   5. Gu, Xiaoxiong
   6. Kwark, Young Hoon
   7. Brüns, Heinz-Dietrich

   2011 - TUHH Open Research
8. Validation and application of physics-based via models to dense via arrays

   1. Gu, Xiaoxiong
   2. Kwark, Young Hoon
   3. Zhang, Yao Jiang
   4. Fan, Jun
   5. Ruehli, Albert
   6. Kotzev, Miroslav A.
   7. Müller, Sebastian

   2011 - TUHH Open Research