5 Einträge gefunden

1. Fast parametric pre-layout analysis of signal integrity for backplane interconnects

   1. Rimolo-Donadio, Renato
   2. Winkel, Thomas Michael
   3. Siviero, Claudio
   4. Kaller, Dierk
   5. Harrer, Hubert
   6. Brüns, Heinz-Dietrich
   7. Schuster, Christian

   2011 - TUHH Open Research
2. Recent developments of via and return current path modeling

   1. Müller, Stefan
   2. Duan, Xiaomin
   3. Rimolo-Donadio, Renato
   4. Brüns, Heinz-Dietrich
   5. Schuster, Christian

   2011 - TUHH Open Research
3. Development, validation, and application of semi-analytical interconnect models for efficient simulation of multilayer substrates

   1. Rimolo-Donadio, Renato

   2011 - TUHH Open Research - frei zugänglich
4. Impact of multiple scattering on passivity of equivalent-circuit via models

   1. Duan, Xiaomin
   2. Rimolo-Donadio, Renato
   3. Müller, Sebastian
   4. Han, Ki Jin
   5. Gu, Xiaoxiong
   6. Kwark, Young Hoon
   7. Brüns, Heinz-Dietrich

   2011 - TUHH Open Research
5. Validation and application of physics-based via models to dense via arrays

   1. Gu, Xiaoxiong
   2. Kwark, Young Hoon
   3. Zhang, Yao Jiang
   4. Fan, Jun
   5. Ruehli, Albert
   6. Kotzev, Miroslav A.
   7. Müller, Sebastian

   2011 - TUHH Open Research