2 Einträge gefunden

1. Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer Substrates

   1. Yildiz, Ömer Faruk
   2. Thomsen, Ole
   3. Bochard, Marc
   4. Yang, Cheng
   5. Schuster, Christian

   2021 - TUHH Open Research
2. Vertically Integrated Microwave-Filters Using Functional Via Structures in LTCC

   1. Yildiz, Ömer Faruk
   2. Thomsen, Ole
   3. Bochard, Marc
   4. Yang, Cheng
   5. Schuster, Christian

   2021 - TUHH Open Research