19 Einträge gefunden

1. Construction of Reciprocal Macromodels in the Loewner Matrix Framework

   1. Carrera-Retana, Luis Ernesto
   2. Marin-Sanchez, Mario
   3. Schuster, Christian
   4. Rimolo-Donadio, Renato

   2023 - TUHH Open Research
2. Improving accuracy after stability enforcement in the Loewner matrix framework

   1. Carrera-Retana, Luis Ernesto
   2. Marin-Sanchez, Mario
   3. Schuster, Christian
   4. Rimolo-Donadio, Renato

   2022 - TUHH Open Research
3. ANN Hyperparameter Optimization by Genetic Algorithms for Via Interconnect Classification

   1. Sanchez-Masis, Allan
   2. Carmona-Cruz, Allan
   3. Schierholz, Christian Morten
   4. Duan, Xiaomin
   5. Roy, Kallol
   6. Yang, Cheng
   7. Rimolo-Donadio, Renato

   2021 - TUHH Open Research
4. SI/PI-database of PCB-based interconnects for machine learning applications

   1. Schierholz, Christian
   2. Sanchez-Masis, Allan
   3. Carmona-Cruz, Allan
   4. Duan, Xiaomin
   5. Roy, Kallol
   6. Yang, Cheng
   7. Rimolo-Donadio, Renato

   2021 - TUHH Open Research - frei zugänglich
5. Mode Conversion Due to Residual Via Stubs in Differential Signaling

   1. Cedeño-Chaves, Jonathan
   2. Scharff, Katharina
   3. Carmona-Cruz, Allan
   4. Brüns, Heinz-Dietrich
   5. Rimolo-Donadio, Renato
   6. Schuster, Christian

   2019 - TUHH Open Research
6. Via Transition Optimization Using a Domain Decomposition Approach

   1. Carmona-Cruz, Allan
   2. Scharff, Katharina
   3. Cedeño-Chaves, Jonathan
   4. Brüns, Heinz-Dietrich
   5. Rimolo-Donadio, Renato
   6. Schuster, Christian

   2019 - TUHH Open Research
7. Efficient construction of interconnect passive macromodels through segmented analysis

   1. Carrera-Retana, Luis Ernesto
   2. Rimolo-Donadio, Renato
   3. Schuster, Christian

   2018 - TUHH Open Research
8. Evaluation of vector fitting for compact interconnect model representation

   1. Carrera-Retana, Luis Ernesto
   2. Rimolo-Donadio, Renato
   3. Schuster, Christian

   2017 - TUHH Open Research
9. Efficient prediction of equalization effort and channel performance for PCB-based data links

   1. Reuschel, Torsten
   2. Preibisch, Jan
   3. Scharff, Katharina
   4. Rimolo-Donadio, Renato
   5. Duan, Xiaomin
   6. Kwark, Young Hoon
   7. Schuster, Christian

   2017 - TUHH Open Research
10. Evaluation of concatenation techniques for state-space interconnect macromodels

    1. Carrera-Retana, Luis Ernesto
    2. Rimolo-Donadio, Renato
    3. Schuster, Christian

    2017 - TUHH Open Research
11. Energy-aware signal integrity analysis for high-speed PCB links

    1. Müller, Sebastian
    2. Reuschel, Torsten
    3. Rimolo-Donadio, Renato
    4. Kwark, Young Hoon
    5. Brüns, Heinz-Dietrich
    6. Schuster, Christian

    2015 - TUHH Open Research
12. Complete modeling of large via constellations in multilayer printed circuit boards

    1. Müller, Sebastian
    2. Happ, Fabian
    3. Duan, Xiaomin
    4. Rimolo-Donadio, Renato
    5. Brüns, Heinz-Dietrich
    6. Schuster, Christian

    2013 - TUHH Open Research
13. Signal and power integrity (SPI) co-analysis for high-speed communication channels

    1. Rimolo-Donadio, Renato
    2. Duan, Xiaomin
    3. Kwark, Young Hoon
    4. Gu, Xiaoxiong
    5. Baks, Christian W.
    6. Müller, Sebastian
    7. Winkel, Thomas Michael

    2013 - TUHH Open Research
14. Application of vias as functional elements in microwave coupling structures

    1. Hardock, Andreas
    2. Rimolo-Donadio, Renato
    3. Brüns, Heinz-Dietrich
    4. Schuster, Christian

    2013 - TUHH Open Research
15. Analytical extraction of via near-field coupling using a multiple scattering approach

    1. Müller, Sebastian
    2. Hardock, Andreas
    3. Rimolo-Donadio, Renato
    4. Brüns, Heinz-Dietrich
    5. Schuster, Christian

    2013 - TUHH Open Research
16. Impact of multiple scattering on passivity of equivalent-circuit via models

    1. Duan, Xiaomin
    2. Rimolo-Donadio, Renato
    3. Müller, Sebastian
    4. Han, Ki Jin
    5. Gu, Xiaoxiong
    6. Kwark, Young Hoon
    7. Brüns, Heinz-Dietrich

    2011 - TUHH Open Research
17. Validation and application of physics-based via models to dense via arrays

    1. Gu, Xiaoxiong
    2. Kwark, Young Hoon
    3. Zhang, Yao Jiang
    4. Fan, Jun
    5. Ruehli, Albert
    6. Kotzev, Miroslav A.
    7. Müller, Sebastian

    2011 - TUHH Open Research
18. Recent developments of via and return current path modeling

    1. Müller, Stefan
    2. Duan, Xiaomin
    3. Rimolo-Donadio, Renato
    4. Brüns, Heinz-Dietrich
    5. Schuster, Christian

    2011 - TUHH Open Research
19. Fast parametric pre-layout analysis of signal integrity for backplane interconnects

    1. Rimolo-Donadio, Renato
    2. Winkel, Thomas Michael
    3. Siviero, Claudio
    4. Kaller, Dierk
    5. Harrer, Hubert
    6. Brüns, Heinz-Dietrich
    7. Schuster, Christian

    2011 - TUHH Open Research