10 Einträge gefunden

1. Effect of 3D stack-up integration on through silicon via characteristics

   1. Dahl, David
   2. Ndip, Ivan N.
   3. Lang, Klaus-Dieter
   4. Schuster, Christian

   2017 - TUHH Open Research
2. High Frequency Characterization of Silicon Substrate and through Silicon Vias

   1. Duan, Xiaomin
   2. Böttcher, Mathias
   3. Dahl, David
   4. Schuster, Christian
   5. Tschoban, Christian
   6. Ndip, Ivan N.
   7. Lang, Klaus-Dieter

   2016 - TUHH Open Research
3. Efficient total crosstalk analysis of large via arrays in silicon interposers

   1. Dahl, David
   2. Reuschel, Torsten
   3. Preibisch, Jan
   4. Duan, Xiaomin
   5. Ndip, Ivan N.
   6. Lang, Klaus-Dieter
   7. Schuster, Christian

   2016 - TUHH Open Research
4. On the upper bound of total uncorrelated crosstalk in large through silicon via arrays

   1. Dahl, David
   2. Reuschel, Torsten
   3. Duan, Xiaomin
   4. Ndip, Ivan N.
   5. Lang, Klaus-Dieter
   6. Schuster, Christian

   2016 - TUHH Open Research
5. Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz

   1. Duan, Xiaomin
   2. Böttcher, Mathias
   3. Dobritz, Stephan
   4. Dahl, David
   5. Schuster, Christian
   6. Ndip, Ivan N.
   7. Lang, Klaus-Dieter

   2016 - TUHH Open Research
6. Efficient computation of localized fields for through silicon via modeling up to 500 GHz

   1. Dahl, David
   2. Duan, Xiaomin
   3. Ndip, Ivan N.
   4. Lang, Klaus-Dieter
   5. Schuster, Christian

   2015 - TUHH Open Research
7. A rigorous approach for the modeling of through-silicon-via pairs using multipole expansions

   1. Duan, Xiaomin
   2. Dahl, David
   3. Ndip, Ivan N.
   4. Lang, Klaus-Dieter
   5. Schuster, Christian

   2015 - TUHH Open Research
8. Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method

   1. Duan, Xiaomin
   2. Dahl, David
   3. Schuster, Christian
   4. Ndip, Ivan N.
   5. Lang, Klaus-Dieter

   2015 - TUHH Open Research
9. Application of the transverse resonance method for efficient extraction of the dispersion relation of arbitrary layers in silicon interposers

   1. Dahl, David
   2. Duan, Xiaomin
   3. Beyreuther, Anne
   4. Ndip, Ivan N.
   5. Lang, Klaus-Dieter
   6. Schuster, Christian

   2013 - TUHH Open Research
10. Applying a physics-based via model for the simulation of Through Silicon Vias

    1. Dahl, David
    2. Duan, Xiaomin
    3. Beyreuther, Anne
    4. Ndip, Ivan N.
    5. Lang, Klaus-Dieter
    6. Schuster, Christian

    2013 - TUHH Open Research