21 Einträge gefunden

1. Prediction of Frequency Dependent Shielding Behavior for Ground Via Fences in Printed Circuit Boards

   1. Hillebrecht, T.
   2. Dahl, David
   3. Schuster, Christian

   2019 - TUHH Open Research
2. Efficient Simulation of Substrate-Integrated Waveguide Antennas Using a Hybrid Boundary Element Method

   1. Dahl, David
   2. Brüns, Heinz-Dietrich
   3. Wang, Lei
   4. Frick, Eduard
   5. Seifert, Christian
   6. Lindner, Marko
   7. Schuster, Christian

   2019 - TUHH Open Research
3. An Intrusive PCE Extension of the Contour Integral Method and its Application in Electrical Engineering

   1. Frick, Eduard
   2. Dahl, David
   3. Seifert, Christian
   4. Lindner, Marko
   5. Schuster, Christian

   2019 - TUHH Open Research
4. Quantifying the impact of RF probing variability on TRL calibration for LTCC substrates

   1. Yildiz, Ömer Faruk
   2. Dahl, David
   3. Schuster, Christian

   2019 - TUHH Open Research
5. Multiscale Simulation of 2-D Photonic Crystal Structures Using a Contour Integral Method

   1. Dahl, David
   2. Frick, Eduard
   3. Seifert, Christian
   4. Lindner, Marko
   5. Schuster, Christian

   2019 - TUHH Open Research
6. Physical scaling effects of differential crosstalk in via arrays up to frequencies of 100 GHz

   1. Scharff, Katharina
   2. Dahl, David
   3. Brüns, Heinz-Dietrich
   4. Schuster, Christian

   2018 - TUHH Open Research
7. Novel Method for Error Estimation in Applications of Polynomial Chaos Expansion to Stochastic Modeling of Multi-Resonant Systems

   1. Frick, Eduard
   2. Dahl, David
   3. Seifert, Christian
   4. Lindner, Marko
   5. Schuster, Christian

   2018 - TUHH Open Research
8. Electromagnetic modeling and optimization of through silicon vias

   1. Dahl, David

   2018 - TUHH Open Research - frei zugänglich
9. Feasibility of uncertainty quantification for power distribution network modeling using PCE and a contour integral method

   1. Dahl, David
   2. Yildiz, Ömer Faruk
   3. Frick, Eduard
   4. Seifert, Christian
   5. Lindner, Marko
   6. Schuster, Christian

   2018 - TUHH Open Research
10. Effect of 3D stack-up integration on through silicon via characteristics

    1. Dahl, David
    2. Ndip, Ivan N.
    3. Lang, Klaus-Dieter
    4. Schuster, Christian

    2017 - TUHH Open Research
11. Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz

    1. Duan, Xiaomin
    2. Böttcher, Mathias
    3. Dobritz, Stephan
    4. Dahl, David
    5. Schuster, Christian
    6. Ndip, Ivan N.
    7. Lang, Klaus-Dieter

    2016 - TUHH Open Research
12. High Frequency Characterization of Silicon Substrate and through Silicon Vias

    1. Duan, Xiaomin
    2. Böttcher, Mathias
    3. Dahl, David
    4. Schuster, Christian
    5. Tschoban, Christian
    6. Ndip, Ivan N.
    7. Lang, Klaus-Dieter

    2016 - TUHH Open Research
13. Efficient total crosstalk analysis of large via arrays in silicon interposers

    1. Dahl, David
    2. Reuschel, Torsten
    3. Preibisch, Jan
    4. Duan, Xiaomin
    5. Ndip, Ivan N.
    6. Lang, Klaus-Dieter
    7. Schuster, Christian

    2016 - TUHH Open Research
14. Modeling of differential striplines in segmented simulation of printed circuit board links

    1. Reuschel, Torsten
    2. Kotzev, Miroslav A.
    3. Dahl, David
    4. Schuster, Christian

    2016 - TUHH Open Research
15. On the upper bound of total uncorrelated crosstalk in large through silicon via arrays

    1. Dahl, David
    2. Reuschel, Torsten
    3. Duan, Xiaomin
    4. Ndip, Ivan N.
    5. Lang, Klaus-Dieter
    6. Schuster, Christian

    2016 - TUHH Open Research
16. Efficient computation of localized fields for through silicon via modeling up to 500 GHz

    1. Dahl, David
    2. Duan, Xiaomin
    3. Ndip, Ivan N.
    4. Lang, Klaus-Dieter
    5. Schuster, Christian

    2015 - TUHH Open Research
17. Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method

    1. Duan, Xiaomin
    2. Dahl, David
    3. Schuster, Christian
    4. Ndip, Ivan N.
    5. Lang, Klaus-Dieter

    2015 - TUHH Open Research
18. A rigorous approach for the modeling of through-silicon-via pairs using multipole expansions

    1. Duan, Xiaomin
    2. Dahl, David
    3. Ndip, Ivan N.
    4. Lang, Klaus-Dieter
    5. Schuster, Christian

    2015 - TUHH Open Research
19. Efficient calculation of external fringing capacitances for physics-based PCB modeling

    1. Hardock, Andreas
    2. Dahl, David
    3. Brüns, Heinz-Dietrich
    4. Schuster, Christian

    2015 - TUHH Open Research
20. Application of the transverse resonance method for efficient extraction of the dispersion relation of arbitrary layers in silicon interposers

    1. Dahl, David
    2. Duan, Xiaomin
    3. Beyreuther, Anne
    4. Ndip, Ivan N.
    5. Lang, Klaus-Dieter
    6. Schuster, Christian

    2013 - TUHH Open Research