7 Einträge gefunden

1. Applying a physics-based via model for the simulation of Through Silicon Vias

   1. Dahl, David
   2. Duan, Xiaomin
   3. Beyreuther, Anne
   4. Ndip, Ivan N.
   5. Lang, Klaus-Dieter
   6. Schuster, Christian

   2013 - TUHH Open Research
2. Complete modeling of large via constellations in multilayer printed circuit boards

   1. Müller, Sebastian
   2. Happ, Fabian
   3. Duan, Xiaomin
   4. Rimolo-Donadio, Renato
   5. Brüns, Heinz-Dietrich
   6. Schuster, Christian

   2013 - TUHH Open Research
3. Characterization of TSV-induced loss and substrate noise coupling in advanced three-dimensional CMOS SOI technology

   1. Gu, Xiaoxiong
   2. Silberman, Joel A.
   3. Young, Albert M.
   4. Jenkins, Keith A.
   5. Dang, Bing
   6. Liu, Yong
   7. Duan, Xiaomin

   2013 - TUHH Open Research
4. Signal and power integrity (SPI) co-analysis for high-speed communication channels

   1. Rimolo-Donadio, Renato
   2. Duan, Xiaomin
   3. Kwark, Young Hoon
   4. Gu, Xiaoxiong
   5. Baks, Christian W.
   6. Müller, Sebastian
   7. Winkel, Thomas Michael

   2013 - TUHH Open Research
5. Extensions to the contour integral method for efficient modeling of TM scattering in two-dimensional photonic crystals

   1. Preibisch, Jan
   2. Duan, Xiaomin
   3. Schuster, Christian

   2013 - TUHH Open Research
6. Application of the transverse resonance method for efficient extraction of the dispersion relation of arbitrary layers in silicon interposers

   1. Dahl, David
   2. Duan, Xiaomin
   3. Beyreuther, Anne
   4. Ndip, Ivan N.
   5. Lang, Klaus-Dieter
   6. Schuster, Christian

   2013 - TUHH Open Research
7. Efficient DC analysis of power planes using contour integral method with circular elements

   1. Duan, Xiaomin
   2. Brüns, Heinz-Dietrich
   3. Schuster, Christian

   2013 - TUHH Open Research