16 Einträge gefunden

1. Chebyshev filter design using vias as quasi-transmission lines in printed circuit boards

   1. Hardock, Andreas
   2. Brüns, Heinz-Dietrich
   3. Schuster, Christian

   2015 - TUHH Open Research
2. Segmented physics-based modeling of multilayer printed circuit boards using stripline ports

   1. Reuschel, Torsten
   2. Müller, Sebastian
   3. Schuster, Christian

   2015 - TUHH Open Research
3. Sensitivity analysis of via impedance using polynomial chaos expansion

   1. Preibisch, Jan
   2. Triverio, Piero
   3. Schuster, Christian

   2015 - TUHH Open Research
4. Efficient computation of localized fields for through silicon via modeling up to 500 GHz

   1. Dahl, David
   2. Duan, Xiaomin
   3. Ndip, Ivan N.
   4. Lang, Klaus-Dieter
   5. Schuster, Christian

   2015 - TUHH Open Research
5. Modeling absorbing materials in cavities with apertures using the thin sheet approximation

   1. Vogt, Alexander
   2. Brüns, Heinz-Dietrich
   3. Fielitz, Helge
   4. Schuster, Christian

   2015 - TUHH Open Research
6. A rigorous approach for the modeling of through-silicon-via pairs using multipole expansions

   1. Duan, Xiaomin
   2. Dahl, David
   3. Ndip, Ivan N.
   4. Lang, Klaus-Dieter
   5. Schuster, Christian

   2015 - TUHH Open Research
7. Efficient calculation of external fringing capacitances for physics-based PCB modeling

   1. Hardock, Andreas
   2. Dahl, David
   3. Brüns, Heinz-Dietrich
   4. Schuster, Christian

   2015 - TUHH Open Research
8. Modeling of mutual coupling between coaxial probes in flat metallic casings using the contour integral method

   1. Wu, Qi
   2. Vogt, Alexander
   3. Preibisch, Jan
   4. Hardock, Andreas
   5. Brüns, Heinz-Dietrich
   6. Schuster, Christian

   2015 - TUHH Open Research
9. Energy-aware signal integrity analysis for high-speed PCB links

   1. Müller, Sebastian
   2. Reuschel, Torsten
   3. Rimolo-Donadio, Renato
   4. Kwark, Young Hoon
   5. Brüns, Heinz-Dietrich
   6. Schuster, Christian

   2015 - TUHH Open Research
10. Numerical and experimental evaluation of electromagnetic coupling between radiating antenna structures inside a computer casing

    1. Wu, Qi
    2. Vogt, Alexander
    3. Brüns, Heinz-Dietrich
    4. Gronwald, Frank
    5. Schuster, Christian

    2015 - TUHH Open Research
11. Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method

    1. Duan, Xiaomin
    2. Dahl, David
    3. Schuster, Christian
    4. Ndip, Ivan N.
    5. Lang, Klaus-Dieter

    2015 - TUHH Open Research
12. An efficient hybrid finite-element analysis of multiple vias sharing the same anti-pad in an arbitrarily shaped parallel-plate pair

    1. Zhang, Yao Jiang
    2. Ren, Liehui
    3. Liu, Dazhao
    4. De, Soumya
    5. Gu, Xiaoxiong
    6. Kwark, Young Hoon
    7. Schuster, Christian

    2015 - TUHH Open Research
13. Using coupled vias for band-pass filters in multilayered printed-circuit boards

    1. Hardock, Andreas
    2. Schuster, Christian

    2015 - TUHH Open Research
14. Physics-based via and waveguide models for efficient SIW simulations in multilayer substrates

    1. Preibisch, Jan
    2. Hardock, Andreas
    3. Schuster, Christian

    2015 - TUHH Open Research
15. A measurement setup for quantification of electromagnetic interference in metallic casings

    1. Vogt, Alexander
    2. Brüns, Heinz-Dietrich
    3. Wu, Qi
    4. Gronwald, Frank
    5. Schuster, Christian

    2015 - TUHH Open Research
16. Validation of a flexible causality treatment for transient analysis of nonlinearly loaded structures

    1. Yang, Cheng
    2. Brüns, Heinz-Dietrich
    3. Liu, Peiguo
    4. Schuster, Christian

    2015 - TUHH Open Research