Autor/in Dahl, David 10 Lang, Klaus-Dieter Ndip, Ivan N. 10 Schuster, Christian 10 Duan, Xiaomin 9 Beyreuther, Anne 2 Böttcher, Mathias 2 Reuschel, Torsten 2 Dobritz, Stephan 1 Preibisch, Jan 1 Tschoban, Christian 1 alle zeigenListe einklappen
Effect of 3D stack-up integration on through silicon via characteristics Dahl, David Ndip, Ivan N. Lang, Klaus-Dieter Schuster, Christian 2017 - TUHH Open Research
High Frequency Characterization of Silicon Substrate and through Silicon Vias Duan, Xiaomin Böttcher, Mathias Dahl, David Schuster, Christian Tschoban, Christian Ndip, Ivan N. Lang, Klaus-Dieter 2016 - TUHH Open Research
Efficient total crosstalk analysis of large via arrays in silicon interposers Dahl, David Reuschel, Torsten Preibisch, Jan Duan, Xiaomin Ndip, Ivan N. Lang, Klaus-Dieter Schuster, Christian 2016 - TUHH Open Research
On the upper bound of total uncorrelated crosstalk in large through silicon via arrays Dahl, David Reuschel, Torsten Duan, Xiaomin Ndip, Ivan N. Lang, Klaus-Dieter Schuster, Christian 2016 - TUHH Open Research
Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz Duan, Xiaomin Böttcher, Mathias Dobritz, Stephan Dahl, David Schuster, Christian Ndip, Ivan N. Lang, Klaus-Dieter 2016 - TUHH Open Research
A rigorous approach for the modeling of through-silicon-via pairs using multipole expansions Duan, Xiaomin Dahl, David Ndip, Ivan N. Lang, Klaus-Dieter Schuster, Christian 2015 - TUHH Open Research
Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method Duan, Xiaomin Dahl, David Schuster, Christian Ndip, Ivan N. Lang, Klaus-Dieter 2015 - TUHH Open Research
Efficient computation of localized fields for through silicon via modeling up to 500 GHz Dahl, David Duan, Xiaomin Ndip, Ivan N. Lang, Klaus-Dieter Schuster, Christian 2015 - TUHH Open Research
Applying a physics-based via model for the simulation of Through Silicon Vias Dahl, David Duan, Xiaomin Beyreuther, Anne Ndip, Ivan N. Lang, Klaus-Dieter Schuster, Christian 2013 - TUHH Open Research
Application of the transverse resonance method for efficient extraction of the dispersion relation of arbitrary layers in silicon interposers Dahl, David Duan, Xiaomin Beyreuther, Anne Ndip, Ivan N. Lang, Klaus-Dieter Schuster, Christian 2013 - TUHH Open Research