12 Einträge gefunden

1. Segmented physics-based modeling of multilayer printed circuit boards using stripline ports

   1. Reuschel, Torsten
   2. Müller, Sebastian
   3. Schuster, Christian

   2015 - TUHH Open Research
2. Energy-aware signal integrity analysis for high-speed PCB links

   1. Müller, Sebastian
   2. Reuschel, Torsten
   3. Rimolo-Donadio, Renato
   4. Kwark, Young Hoon
   5. Brüns, Heinz-Dietrich
   6. Schuster, Christian

   2015 - TUHH Open Research
3. Solubility and ordering of Ti, Ta, Mo and W on the Al sublattice in L1₂-Co₃Al

   1. Koßmann, J.
   2. Hammerschmidt, T.
   3. Maisel, Sascha
   4. Müller, Sebastian
   5. Drautz, R.

   2015 - TUHH Open Research
4. Via array modeling for application in fast, energy-efficient digital systems

   1. Müller, Sebastian

   2014 - TUHH Open Research - frei zugänglich
5. Signal and power integrity (SPI) co-analysis for high-speed communication channels

   1. Rimolo-Donadio, Renato
   2. Duan, Xiaomin
   3. Kwark, Young Hoon
   4. Gu, Xiaoxiong
   5. Baks, Christian W.
   6. Müller, Sebastian
   7. Winkel, Thomas Michael

   2013 - TUHH Open Research
6. Analytical extraction of via near-field coupling using a multiple scattering approach

   1. Müller, Sebastian
   2. Hardock, Andreas
   3. Rimolo-Donadio, Renato
   4. Brüns, Heinz-Dietrich
   5. Schuster, Christian

   2013 - TUHH Open Research
7. Realization of ultra-low power I/O

   1. Shan, Lei
   2. Dickson, Timothy
   3. Kwark, Young Hoon
   4. Baks, Christian W.
   5. Becker, Dale
   6. Krabbenhoft, Roger
   7. Chainer, Timothy

   2013 - TUHH Open Research
8. Complete modeling of large via constellations in multilayer printed circuit boards

   1. Müller, Sebastian
   2. Happ, Fabian
   3. Duan, Xiaomin
   4. Rimolo-Donadio, Renato
   5. Brüns, Heinz-Dietrich
   6. Schuster, Christian

   2013 - TUHH Open Research
9. Energy-aware analysis of electrically long high speed I/O links

   1. Müller, Sebastian
   2. Duan, Xiaomin
   3. Schuster, Christian

   2012 - TUHH Open Research
10. Validation and application of physics-based via models to dense via arrays

    1. Gu, Xiaoxiong
    2. Kwark, Young Hoon
    3. Zhang, Yao Jiang
    4. Fan, Jun
    5. Ruehli, Albert
    6. Kotzev, Miroslav A.
    7. Müller, Sebastian

    2011 - TUHH Open Research
11. Impact of multiple scattering on passivity of equivalent-circuit via models

    1. Duan, Xiaomin
    2. Rimolo-Donadio, Renato
    3. Müller, Sebastian
    4. Han, Ki Jin
    5. Gu, Xiaoxiong
    6. Kwark, Young Hoon
    7. Brüns, Heinz-Dietrich

    2011 - TUHH Open Research
12. Applying functionally graded materials by laser cladding: a cost-effective way to improve the lifetime of die-casting dies

    1. Müller, Sebastian
    2. Pries, Helge
    3. Dilger, Klaus
    4. Ocylok, Sörn
    5. Weisheit, Andreas
    6. Kelbassa, Ingomar

    2011 - TUHH Open Research