16 Einträge gefunden

1. Efficient computation of localized fields for through silicon via modeling up to 500 GHz

   1. Dahl, David
   2. Duan, Xiaomin
   3. Ndip, Ivan N.
   4. Lang, Klaus-Dieter
   5. Schuster, Christian

   2015 - TUHH Open Research
2. A rigorous approach for the modeling of through-silicon-via pairs using multipole expansions

   1. Duan, Xiaomin
   2. Dahl, David
   3. Ndip, Ivan N.
   4. Lang, Klaus-Dieter
   5. Schuster, Christian

   2015 - TUHH Open Research
3. Validation of a flexible causality treatment for transient analysis of nonlinearly loaded structures

   1. Yang, Cheng
   2. Brüns, Heinz-Dietrich
   3. Liu, Peiguo
   4. Schuster, Christian

   2015 - TUHH Open Research
4. A measurement setup for quantification of electromagnetic interference in metallic casings

   1. Vogt, Alexander
   2. Brüns, Heinz-Dietrich
   3. Wu, Qi
   4. Gronwald, Frank
   5. Schuster, Christian

   2015 - TUHH Open Research
5. Using coupled vias for band-pass filters in multilayered printed-circuit boards

   1. Hardock, Andreas
   2. Schuster, Christian

   2015 - TUHH Open Research
6. An efficient hybrid finite-element analysis of multiple vias sharing the same anti-pad in an arbitrarily shaped parallel-plate pair

   1. Zhang, Yao Jiang
   2. Ren, Liehui
   3. Liu, Dazhao
   4. De, Soumya
   5. Gu, Xiaoxiong
   6. Kwark, Young Hoon
   7. Schuster, Christian

   2015 - TUHH Open Research
7. Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method

   1. Duan, Xiaomin
   2. Dahl, David
   3. Schuster, Christian
   4. Ndip, Ivan N.
   5. Lang, Klaus-Dieter

   2015 - TUHH Open Research
8. Segmented physics-based modeling of multilayer printed circuit boards using stripline ports

   1. Reuschel, Torsten
   2. Müller, Sebastian
   3. Schuster, Christian

   2015 - TUHH Open Research
9. Numerical and experimental evaluation of electromagnetic coupling between radiating antenna structures inside a computer casing

   1. Wu, Qi
   2. Vogt, Alexander
   3. Brüns, Heinz-Dietrich
   4. Gronwald, Frank
   5. Schuster, Christian

   2015 - TUHH Open Research
10. Physics-based via and waveguide models for efficient SIW simulations in multilayer substrates

    1. Preibisch, Jan
    2. Hardock, Andreas
    3. Schuster, Christian

    2015 - TUHH Open Research
11. Chebyshev filter design using vias as quasi-transmission lines in printed circuit boards

    1. Hardock, Andreas
    2. Brüns, Heinz-Dietrich
    3. Schuster, Christian

    2015 - TUHH Open Research
12. Modeling absorbing materials in cavities with apertures using the thin sheet approximation

    1. Vogt, Alexander
    2. Brüns, Heinz-Dietrich
    3. Fielitz, Helge
    4. Schuster, Christian

    2015 - TUHH Open Research
13. Modeling of mutual coupling between coaxial probes in flat metallic casings using the contour integral method

    1. Wu, Qi
    2. Vogt, Alexander
    3. Preibisch, Jan
    4. Hardock, Andreas
    5. Brüns, Heinz-Dietrich
    6. Schuster, Christian

    2015 - TUHH Open Research
14. Efficient calculation of external fringing capacitances for physics-based PCB modeling

    1. Hardock, Andreas
    2. Dahl, David
    3. Brüns, Heinz-Dietrich
    4. Schuster, Christian

    2015 - TUHH Open Research
15. Sensitivity analysis of via impedance using polynomial chaos expansion

    1. Preibisch, Jan
    2. Triverio, Piero
    3. Schuster, Christian

    2015 - TUHH Open Research
16. Energy-aware signal integrity analysis for high-speed PCB links

    1. Müller, Sebastian
    2. Reuschel, Torsten
    3. Rimolo-Donadio, Renato
    4. Kwark, Young Hoon
    5. Brüns, Heinz-Dietrich
    6. Schuster, Christian

    2015 - TUHH Open Research