Autor/in Bochard, Marc Schuster, Christian 4 Yang, Cheng 4 Yildiz, Ömer Faruk 4 Pathe, Nico 2 Thomsen, Ole 2 alle zeigenListe einklappen
Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer Substrates Yildiz, Ömer Faruk Thomsen, Ole Bochard, Marc Yang, Cheng Schuster, Christian 2021 - TUHH Open Research
Vertically Integrated Microwave-Filters Using Functional Via Structures in LTCC Yildiz, Ömer Faruk Thomsen, Ole Bochard, Marc Yang, Cheng Schuster, Christian 2021 - TUHH Open Research
Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently Yildiz, Ömer Faruk Pathe, Nico Bochard, Marc Yang, Cheng Schuster, Christian 2021 - TUHH Open Research
Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics Yildiz, Ömer Faruk Pathe, Nico Bochard, Marc Yang, Cheng Schuster, Christian 2021 - TUHH Open Research