Autor/in Dang, Bing Duan, Xiaomin Gordin, Rachel 1 Goren, David 1 Gu, Xiaoxiong 1 Jenkins, Keith A. 1 Liu, Yong 1 Shlafman, Shlomo 1 Silberman, Joel A. 1 Young, Albert M. 1 alle zeigenListe einklappen
Characterization of TSV-induced loss and substrate noise coupling in advanced three-dimensional CMOS SOI technology Gu, Xiaoxiong Silberman, Joel A. Young, Albert M. Jenkins, Keith A. Dang, Bing Liu, Yong Duan, Xiaomin 2013 - TUHH Open Research
