On-orbit verification of an LTCC double flip-chip packaging concept in an S-/K-band satellite transponder

Link:

https://hdl.handle.net/11420/6020

Autor/in:

Verlag/Körperschaft:

Hamburg University of Technology

Erscheinungsjahr:

2013

Medientyp:

Text

Schlagworte:

600: Technik
620: Ingenieurwissenschaften

Beschreibung:

The on-orbit verification of a double flip-chip packaging concept using low temperature co-fired ceramic (LTCC) technology is presented. Modules based on this concept were designed, fabricated, and assembled as a transparent transponder system. This system is an experimental payload on a small scientific satellite which was launched on July 22, 2012. The transponder uses S-band signaling for the up- and downlink and internally converts the signal to the K-band. The K-band stage employs multiple redundant LTCC modules to improve robustness against failure. The success of the mission is demonstrated by the presented results of a live communication link between the ground station and the experimental payload. This demonstrates technology readiness of the LTCC modules and the underlying packaging concept. © 2013 IEEE.

Beziehungen:

DOI 10.1109/MWSYM.2013.6697451

Quellsystem:

TUHH Open Research

Interne Metadaten

Quelldatensatz: oai:tore.tuhh.de:11420/6020