A vertical interconnect for densely packed active antenna array front-ends between K- and V-band is studied in this paper. The interconnect provides DC-blocking, which is useful for hybrid integration of switched or active components within a vertical module stack. The DC-blocking functionality is implemented using the solder mask film commonly available in low-cost PCB fabrication processes. The design is robust against lateral misalignment and compatible with a wide range of solder mask dielectrics. The measured performance shows good matching between 20 GHz and 50 GHz, which makes the design attractive for current and emerging satellite communication bands.
