12 Einträge gefunden

1. Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer Substrates

   1. Yildiz, Ömer Faruk
   2. Thomsen, Ole
   3. Bochard, Marc
   4. Yang, Cheng
   5. Schuster, Christian

   2021 - TUHH Open Research
2. Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently

   1. Yildiz, Ömer Faruk
   2. Pathe, Nico
   3. Bochard, Marc
   4. Yang, Cheng
   5. Schuster, Christian

   2021 - TUHH Open Research
3. Distributed Nonlinear Shielding in Power Delivery Networks on Printed Circuit Boards

   1. Wendt, Torben
   2. Yang, Cheng
   3. Schuster, Christian
   4. De Stefano, Marco
   5. Grivet-Talocia, Stefano

   2021 - TUHH Open Research
4. Numerical Analysis of Two MIMO Channels Carrying Orbital Angular Momentum (OAM)

   1. Wang, Lei
   2. Wulff, Michael
   3. Yang, Cheng
   4. Schuster, Christian

   2021 - TUHH Open Research
5. Evaluation of Support Vector Machines for PCB based Power Delivery Network Classification

   1. Schierholz, Morten
   2. Hassab, Youcef
   3. Yang, Cheng
   4. Schuster, Christian

   2021 - TUHH Open Research
6. Efficient and Flexible Huygens' Source Replacement of mm-scale Human Brain Implants

   1. Yang, Cheng
   2. Schierholz, Christian Morten
   3. Trunczik, Eileen
   4. Helmich, Leon Maximilian
   5. Brüns, Heinz-Dietrich
   6. Schuster, Christian

   2021 - TUHH Open Research
7. A multistage adaptive sampling scheme for passivity characterization of large-scale macromodels

   1. De Stefano, Marco
   2. Grivet-Talocia, Stefano
   3. Wendt, Torben
   4. Yang, Cheng
   5. Schuster, Christian

   2021 - TUHH Open Research
8. SI/PI-database of PCB-based interconnects for machine learning applications

   1. Schierholz, Christian
   2. Sanchez-Masis, Allan
   3. Carmona-Cruz, Allan
   4. Duan, Xiaomin
   5. Roy, Kallol
   6. Yang, Cheng
   7. Rimolo-Donadio, Renato

   2021 - TUHH Open Research - frei zugänglich
9. Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics

   1. Yildiz, Ömer Faruk
   2. Pathe, Nico
   3. Bochard, Marc
   4. Yang, Cheng
   5. Schuster, Christian

   2021 - TUHH Open Research
10. ANN Hyperparameter Optimization by Genetic Algorithms for Via Interconnect Classification

    1. Sanchez-Masis, Allan
    2. Carmona-Cruz, Allan
    3. Schierholz, Christian Morten
    4. Duan, Xiaomin
    5. Roy, Kallol
    6. Yang, Cheng
    7. Rimolo-Donadio, Renato

    2021 - TUHH Open Research
11. Vertically Integrated Microwave-Filters Using Functional Via Structures in LTCC

    1. Yildiz, Ömer Faruk
    2. Thomsen, Ole
    3. Bochard, Marc
    4. Yang, Cheng
    5. Schuster, Christian

    2021 - TUHH Open Research
12. Analysis and Optimization of Nonlinear Diode Grids for Shielding of Enclosures With Apertures

    1. Yang, Cheng
    2. Wendt, Torben
    3. De Stefano, Marco
    4. Kopf, Marc
    5. Beck, Christopher
    6. Grivet-Talocia, Stefano
    7. Schuster, Christian

    2021 - TUHH Open Research